osTTSe : Tray-Based Vision Solutions
The osTTSe is designed with advanced key technologies to provide high speed, high accuracy, one stop vision inspection solutions specially catered for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP packages handled in tray. |
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osTTSe | |
Package Inspection | QFP, QFN, CSP, TSSOP, MSOP, SOP |
Package Size | 7mm x 7mm to 24mm x 24mm |
Tray Type | JEDEC |
Handling Mechanism | Tray to Tray |
UPH | 10K |
Vision Inspection | 1. 5 Side 3D inspection: Standoff, coplanarity |
2. Top 2D Inspection: Mark, Pin 1, Surface, Chipping, Scratched/Void, 2D Barcode, OCR | |
3. Bottom 2D Inspection: Lead length, Lead Pitch, Lead Width, Lead Count, Lead Quality (Lead Surface), Bend Lead, Span, Slant, Skew | |
Machine Type | Fully Auto |
Tray-Based Vision Solution | Automatic Tray to Tray 2D, 3D, Ball, Leadless Package & Passive Component Inspection System. |
Benefits | High Speed Tray to Tray Vision Inspection High Performance Ease of Operation Automatic Reject Sorting Capability Quick Conversion Time Low Maintenance Cost |
osSTS : Tray-Based Vision Solutions
The osSTS is a compact, semi auto vision inspection solutions specially catered for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP packages handled in tray. |
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osSTS | |
Package Size | 2mm x 2mm to 55mm x 55mm |
Tray Type | Jedec |
Handling Mechanism | Tray to Tray |
Pick-up Heads | 1 |
Machine Dimension (W x D x H) | 2100 x 1060 x 1500 mm |
Vision Inspection | 1. Top 2D Inspection: Laser Mark, Pin 1, Surface, Chipping, Scratched, Dent, Excess Weld, Excess Cement |
2. Bottom 2D Inspection: Chipping, Scratch, Dent, Excess Cement | |
Machine Type | Fully Auto |
Tray-Based Vision Solution | Semi Auto Tray to Tray 2D, Leadless Package & Passive Component Inspection System. |
Benefits | High Performance Ease of Operation Automatic Reject Sorting Capability Quick Conversion Time Low Maintenance Cost |