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Tray-Based Vision Machine

Tray-based Vision Handler

Introducing Ocas Superior Tray-based Vision Handler which performs final inspection on various IC packages handled in tray.

Tray to Tray Series

osTTSe

osSTS

 

Specification Overview

osTTSe : Tray-Based Vision Solutions

The osTTSe is designed with advanced key technologies to provide high speed, high accuracy, one stop vision inspection solutions specially catered for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP packages handled in tray.

osTTSe
Package Inspection QFP, QFN, CSP, TSSOP, MSOP, SOP
Package Size 7mm x 7mm to 24mm x 24mm
Tray Type JEDEC
Handling Mechanism Tray to Tray
UPH 10K
Vision Inspection 1. 5 Side 3D inspection: Standoff, coplanarity
2. Top 2D Inspection: Mark, Pin 1, Surface, Chipping, Scratched/Void, 2D Barcode, OCR
3. Bottom 2D Inspection: Lead length, Lead Pitch, Lead Width, Lead Count, Lead Quality (Lead Surface), Bend Lead, Span, Slant, Skew
Machine Type Fully Auto
Tray-Based Vision Solution Automatic Tray to Tray 2D, 3D, Ball, Leadless Package & Passive Component Inspection System.
Benefits High Speed Tray to Tray Vision Inspection
High Performance
Ease of Operation
Automatic Reject Sorting Capability
Quick Conversion Time
Low Maintenance Cost

 

osSTS : Tray-Based Vision Solutions

The osSTS is a compact, semi auto vision inspection solutions specially catered for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP packages handled in tray.

osSTS
Package Size 2mm x 2mm to 55mm x 55mm
Tray Type Jedec
Handling Mechanism Tray to Tray
Pick-up Heads 1
Machine Dimension (W x D x H) 2100 x 1060 x 1500 mm
Vision Inspection 1. Top 2D Inspection: Laser Mark, Pin 1, Surface, Chipping, Scratched, Dent, Excess Weld, Excess Cement
2. Bottom 2D Inspection: Chipping, Scratch, Dent, Excess Cement
Machine Type Fully Auto
Tray-Based Vision Solution Semi Auto Tray to Tray 2D, Leadless Package & Passive Component Inspection System.
Benefits High Performance
Ease of Operation
Automatic Reject Sorting Capability
Quick Conversion Time
Low Maintenance Cost