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Wafer Based Vision Machine

 

osWIS 100: Wafer Vision Inspection Machine

osWIS 100 Wafer Vision Inspection Handler offers advanced solution for 2D surface defect inspections, measurements and multiple handling mechanisms to support different wafer forms including raw wafer, hoop ring, and framed wafer range from 120mm (6”) to 300mm (12”).

Specification Overview

osWIS 100
Wafer Input Type & Size Raw Wafer – 8” (200mm) , 12” (300mm)
Wafer Ring – 6” (150mm) , 8” (200mm) – manual loading
Framed Wafer – 6” (150mm) , 8” (200mm) , 12” (300mm)
Camera Lens 2X 5x 7.5X
Accuracy 2.2 μm / pixel 0.9 μm / pixel 0.6 μm / pixel
Field of View 9.1mm x 9.1mm 3.6mm x 3.6mm 2.4mm x 2.4mm
System Capability Offline Verifier
Optimize production yield. Once wafer inspection is completed, user can identify, review and reclassify inspection result with Offline Verifier.
Wafer Automated Loader-Unloader
Auto handling supports up to 300mm (12”) raw wafer, hoop ring and framed wafer.
Inspection